OPTOELECTRONIC DEVICE COMPRISING AN ELECTROLUMINESCENT COMPONENT AND A TRANSISTOR

专利摘要:
An optoelectronic device (40) comprising an electroluminescent component (LED) and a field effect transistor (TMOS), the optoelectronic device comprising: a first semiconductor layer (46) of a III-V compound or II- VI doped with a first type of conductivity; an active layer (50) of the electroluminescent component; a second semiconductor layer (54) of the III-V or II-VI compound doped with a second conductivity type opposite to the first type, the active layer being sandwiched between the first and second semiconductor layers, wherein the channel (77) ) of the field effect transistor is located in the first semiconductor layer, the first semiconductor layer being uninterrupted between the field effect transistor and the electroluminescent component.
公开号:FR3044822A1
申请号:FR1561797
申请日:2015-12-03
公开日:2017-06-09
发明作者:Ivan-Christophe Robin；Hubert Bono；Thierry Bouchet；Matthew Charles；Rene Escoffier；Erwan Morvan
申请人:Commissariat a lEnergie Atomique CEA；Commissariat a lEnergie Atomique et aux Energies Alternatives CEA；
IPC主号:

专利说明:

OPTOELECTRONIC DEVICE COMPRISING A LIGHT EMITTING COMPONENT AND A TRANSISTOR
Field
The present application relates to an optoelectronic device comprising an electroluminescent component and a control transistor of the electroluminescent component.
Presentation of the prior art
It is known to control an electroluminescent component, in particular a light emitting diode, by a transistor, in particular a metal-oxide gate field effect transistor, also called a MOS transistor, for example in the case where the electroluminescent component is powered by a voltage. alternative.
It may be desirable for the electroluminescent component and the MOS transistor to be integrated, in particular when the MOS transistor must be a fast transistor, that is to say capable of switching at a frequency of between 300 kHz and 1 MHz.
FIG. 1 represents an electrical diagram of an optoelectronic device 10 comprising an LED light emitting diode connected in series with a metal-oxide gate-effect field effect transistor TMOS, for example an N-channel. The anode of the LED light emitting diode is connected to a node A. The cathode of the light-emitting diode LED is connected to the drain of the TMOS transistor. The source of the TMOS transistor is connected to a node C. The gate of the TMOS transistor is connected to a node G.
Figure 2 is a reproduction of Figure 1 of the publication entitled "Monolithic integration of GaN-based light-emitting diodes and metal-oxide-semiconductor field-effect transistors" by Lee et al (Optics Express, Vol.22, Issue S6 , pp. A1589-A1595, 2014) and is a sectional view of an exemplary embodiment of the optoelectronic device 10 in which the LED and the MOS transistor are integrally formed.
More specifically, the optoelectronic device 10, shown in FIG. 2, has substantially a symmetrical structure of revolution about an axis D and comprises, from the bottom upwards: an insulating sapphire substrate 12; a layer 14 of GaN unintentionally doped; a cylindrical central portion 16 of N-type doped GaN; an annular portion 18 of N type doped GaN, separated from the central portion 16 by an annular recess; on the central portion 16, an active layer 22 comprising multiple quantum wells; on the active layer 22, a layer 24 of GaN doped P type; an insulating layer 26 covering the entire structure; a conductive pad 28, formed of a stack of several layers, in contact with the layer 24 of GaN doped P type through the insulating layer 26 and intended to be connected to the node A; an annular connection track, formed of a stack of several layers, extending over the insulating layer 26 and whose outer edge is in contact with the annular portion 18 of GaN through the insulating layer 26 and whose edge internal is in contact with the central portion 16 through the insulating layer 26, the connection track 30 can be connected to a conductive pad, not shown, allowing the application of an external voltage; an annular conductive pad 32 extending on the insulating layer 26 and forming the gate of the TMOS transistor, the pad 32 being intended to be connected to the node G; and an annular conductive pad 34 formed of a stack of several layers, in contact with the annular portion 18 of GaN through the insulating layer 26 and intended to be connected to the node C.
Although the optoelectronic device shown in Figure 2 works properly, it has several disadvantages. A disadvantage is that it may be difficult to make an optoelectronic device 10 that is compact due to the presence of the recess 20. Another disadvantage is that the upper surface of the optoelectronic device 10, on which the pads 28 are formed, 32 and 34, is irregular. This can make it difficult to attach the optoelectronic device to another electronic circuit on the side of the upper face.
In addition, the cylindrical central portion 16 and the annular portion 18 are formed by the etching of the ink 20 in the N-type doped GaN semiconductor layer. The dopant concentration of this layer is generally high in order to obtain a good performance of the light emitting diode. The dopant concentration at the channel of the TMOS transistor is therefore also high, which imposes a small thickness of the annular portion 18 at the channel of the TMOS transistor. A disadvantage is that the formation of a thin channel can be difficult with the etching processes used for the formation of the annular portion 18 of GaN insofar as the stop of the etching must be carried out in the GaN layer. N-type doped. Indeed, it can not be provided etch stop layer that would disturb the operation of the light emitting diode. summary
Thus, an object of an embodiment is to overcome at least in part the disadvantages of the optoelectronic devices described above and their manufacturing processes.
Another object of an embodiment is that the compactness of the optoelectronic device is increased.
Another object of an embodiment is that the upper surface of the optoelectronic device is substantially planar.
Another object of an embodiment is that the method of manufacturing the optoelectronic device is simple.
Thus, an embodiment provides an optoelectronic device comprising an electroluminescent component and a field effect transistor, the optoelectronic device comprising: a first semiconductor layer of a III-V or II-VI compound doped with a first conductivity type ; an active layer of the electroluminescent component; a second semiconductor layer of the III-V or II-VI compound doped with a second type of conductivity opposite to the first type, the active layer being sandwiched between the first and second semiconductor layers, wherein the channel of the The field is located in the first semiconductor layer, the first semiconductor layer being uninterrupted between the field effect transistor and the electroluminescent component.
According to one embodiment, the optoelectronic device comprises a first trench successively traversing at least the second semiconductor layer, the active layer and only a part of the first semiconductor layer, and containing a first electrically conductive core and a first electrically insulating layer covering the walls of the first trench at least between the first electrically conductive core and the second semiconductor layer and between the first electrically conductive core and the active layer.
According to one embodiment, the first electrically insulating layer covers the walls of the first trench between the first electrically conductive core and the first semiconductor layer.
According to one embodiment, the first electrically conductive core is in contact with the first semiconductor layer.
According to one embodiment, the output work of the material constituting the first electrically conductive core is greater than 4 eV.
According to one embodiment, the optoelectronic device further comprises a third semiconductor layer of the compound III-V or II-VI doped with the first conductivity type having a dopant concentration greater than the dopant concentration of the first semiconductor layer, in contact with the first semiconductor layer and interposed between the first semiconductor layer and the active layer.
According to one embodiment, the optoelectronic device comprises a second trench successively traversing at least the second semiconductor layer, the active layer and all or part of the third semiconductor layer, and containing a second electrically conductive core in contact with the third layer. semiconductor and containing a second electrically insulating layer covering the walls of the second trench at least between the second electrically conductive core and the second semiconductor layer and between the second electrically conductive core and the active layer.
According to one embodiment, the optoelectronic device comprises a first electrically conductive pad in contact with the first electrically conductive core and a second electrically conductive pad in contact with the second electrically conductive core, the first and second pads resting on a flat surface.
According to one embodiment, the active layer is the layer from which the majority of the electromagnetic radiation delivered by the optoelectronic device is emitted.
According to one embodiment, the active layer comprises a single quantum well or multiple quantum wells.
According to one embodiment, the dopant concentration of the first semiconductor layer is between 1015 atoms / cm 2 and 10 1 atoms / cm 3, preferably between 5 5 C atoms / cm 2 and 5 × 10 5 atoms / cm 2.
According to one embodiment, the thickness of the second semiconductor layer vis-à-vis the first trench is between 50 nm and 150 nm when the dopant concentration of the second semiconductor layer is greater than 10 ^ atoms / cm ^.
According to one embodiment, the thickness of the first electrically conductive core is between 10 times and 50 times the thickness of the first semiconductor layer vis-à-vis the first trench.
Another embodiment provides a method of manufacturing an optoelectronic device comprising an electroluminescent component and a field effect transistor, the method comprising the following successive steps: forming a first semiconductor layer of a compound III-V or II- VI doped with a first type of conductivity; forming an active layer of the electroluminescent component; forming a second semiconductor layer of the III-V or II-VI compound doped with a second conductivity type opposite to the first type, the active layer being sandwiched between the first and second semiconductor layers; and forming the field effect transistor channel in the first semiconductor layer, the first semiconductor layer being uninterrupted between the field effect transistor and the electroluminescent component.
According to one embodiment, the method further comprises the steps of: forming a first trench successively traversing at least the second semiconductor layer, the active layer and only a part of the first semiconductor layer; and forming, in the first trench, a first electrically conductive core and a first electrically insulating layer covering the walls of the first trench at least between the first electrically conductive core and the second semiconductor layer and between the first electrically conductive core and the active layer. .
According to one embodiment, the method further comprises the step of forming a third semiconductor layer of the III-V or II-VI doped compound of the first conductivity type having a dopant concentration greater than the dopant concentration. the first semiconductor layer, in contact with the first semiconductor layer and interposed between the first semiconductor layer and the active layer.
According to one embodiment, the method further comprises the steps of: forming a second trench successively traversing at least the second semiconductor layer, the active layer and only a part of the third semiconductor layer; and forming, in the second trench, a second electrically conductive core in contact with the third semiconductor layer and a second electrically insulating layer covering the walls of the second trench at least between the second electrically conductive core and the second semiconductor layer and between the second electrically conductive core and the active layer.
Brief description of the drawings
These and other features and advantages will be set forth in detail in the following description of particular embodiments made without implied limitation in relation to the appended figures among which: FIG. 1, previously described, represents an equivalent electrical diagram an optoelectronic device comprising a light emitting diode and a MOS transistor; Figure 2, described above, is a sectional view of an integrated embodiment of the optoelectronic device shown in Figure 1; Figures 3 and 4 are respectively a sectional view and a top view, partial and schematic, of an integrated embodiment of the optoelectronic device shown in Figure 1; Figure 5 is a partial sectional and schematic sectional view of an optoelectronic system comprising the optoelectronic device shown in Figure 3; FIGS. 6 to 9 represent evolution curves of the current flowing through the light-emitting diode of the optoelectronic device represented in FIG. 3 as a function of the voltage between the nodes A and C of the optoelectronic device for different voltages applied to the gate of the MOS transistor of the device optoelectronics; and FIGS. 10A to 10F are sectional, partial and schematic views of the structures obtained at successive stages of an embodiment of a method of manufacturing the optoelectronic device shown in FIG.
detailed description
For the sake of clarity, the same elements have been designated by the same references in the various figures and, moreover, as is customary in the representation of the electronic circuits, the various figures are not drawn to scale. In addition, only the elements useful for understanding the present description have been shown and are described.
In particular, the power supply means of the optoelectronic devices described below are within the reach of those skilled in the art and are not described. Unless otherwise specified, the terms "approximately", "substantially", and "of the order of" mean within 10%, preferably within 5%.
In the description which follows, when reference is made to absolute position qualifiers, such as the terms "before", "backward", "up", "down", "left", "right", etc., or relative, such as the terms "above", "below", "upper", "lower", etc., or with qualifiers such as "horizontal", "vertical", etc. reference is made to the orientation of the figures or to an optoelectronic device in a normal position of use.
The present application relates to an optoelectronic device comprising an electroluminescent component, for example a light emitting diode, comprising an active layer sandwiched between a first semiconductor layer and a second semiconductor layer. The first and second semiconductor layers are at least partly formed from at least one semiconductor material selected from the group consisting of III-V compounds and II-VI compounds.
The semiconductor material may comprise mainly a III-V compound, for example a III-N compound. Examples of group III elements include gallium (Ga), indium (In) or aluminum (Al). Examples of group V elements include nitrogen, phosphorus or arsenic. Examples of III-V compounds are GaN, AlN, InN, InGaN, AlGaN, AlInGaN, AlxGayIn (] x_y), AsaP (] a) or InP. In general, the elements in compound III-V can be combined with different mole fractions.
The semiconductor material may mainly comprise a II-VI compound. Examples of Group II elements include Group IIA elements, including beryllium (Be) and magnesium (Mg) and Group IIB elements, including zinc (Zn), cadmium (Cd) and mercury ( Hg). Examples of group VI elements include elements of the VIA group, including oxygen (O), sulfur (S), selenium (Se) and tellurium (Te). Examples of compounds II-VI are ZnO, ZnMgO, CdZnO, CdZnMgO, CdHgTe, CdTe, HgTe, ZnSe or ZnS. In general, the elements in II-VI can be combined with different mole fractions.
The semiconductor material may comprise a dopant. By way of example, for compounds III-V, the dopant may be chosen from the group comprising a group II P dopant, for example magnesium (Mg), zinc (Zn), cadmium (Cd ) or mercury (Hg), a Group IV P-type dopant, for example carbon (C) or a group IV N-type dopant, for example silicon (Si), germanium (Ge), lithium tin (Sn), or group VI such as selenium (Se), sulfur (S), or terbium (Tb). Preferably, for GaN, the P-type dopant is magnesium and the N-type dopant is silicon.
The active layer is the layer from which the majority of the radiation provided by the optoelectronic device is emitted. The active layer may comprise containment means. For example, the layer may comprise a single quantum well. It then comprises a semiconductor material different from the semiconductor material forming the first semiconductor layer and the second semiconductor layer and having a lower bandgap than the material forming the first semiconductor layer and the second semiconductor layer. For example, when the semiconductor layers are predominantly a compound III-V, the active layer may comprise an alloy of the compound III-V and a third element including InGaN or AlInGaN. The active layer may comprise multiple quantum wells. It then comprises a stack of semiconductor layers forming an alternation of quantum wells and barrier layers.
Embodiments will be described in more detail in the case of an optoelectronic device whose first and second semiconductor layers mainly comprise GaN. However, it is clear that the semiconductor material making up the first and second semiconductor layers can correspond to any semiconductor material selected from the group consisting of compounds III-V and compounds II-VI.
Figures 3 and 4 show an embodiment of an optoelectronic device 40 whose equivalent electrical diagram is that shown in Figure 1 and wherein the LED and the LED MOS transistor are integrally formed.
More specifically, the optoelectronic device 40 has substantially a symmetrical structure of revolution about an axis E and comprises, from the bottom upwards in FIG. 3: a substrate 42; a transition layer 44, preferably insulating, which may correspond to a stack 44 of semiconductor layers; a layer 46 of GaN doped with a first type of conductivity, for example doped with N type, with a first concentration of dopants; a layer 48 of GaN doped with the first type of conductivity, for example doped with N type, with a second dopant concentration higher than the first concentration of dopants; an active layer 50; optionally, a barrier layer 52, for example a doped AlGaN layer of a second conductivity type opposite to the first conductivity type, for example doped P type; a layer 54 of doped GaN of the second type of conductivity opposite to the first type of conductivity, for example doped P type; an electrically conductive layer 56, for example metallic; an electrically insulating layer 58; a first trench 60, for example annular, traversing the entire thickness of the conductive layer 56, the P-type doped GaN 54 layer, the barrier layer 52, the active layer 50 and the layer 48 of N-type strongly doped GaN and passing through only a portion of the less heavily N-type GaN layer 46, the first trench 60 defining a central portion 61, for example cylindrical, in layers 48, 50, 52, 54 and 56 ; an electrically insulating layer 62 covering the walls of the trench 60; a core 64 of electrically conductive material filling the first trench 60; a second trench 66, for example annular, traversing the entire thickness of the conductive layer 56, the layer 54 of P-type doped GaN, the barrier layer 52 and the active layer 50 and passing through all or a part of the layer 48 of heavily doped N-type GaN, the second trench 66 being located around the first trench 60; an electrically insulating layer 68 covering the side walls of the trench 66 facing the conductive layer 56, the P-type doped GaN layer 54, the barrier layer 52 and the active layer 50, covering optionally the side walls of the trench 66 facing the layer 48 of highly doped GaN type N and not covering the bottom of the trench 66 located in the layer 48 of N-type highly doped GaN; a core 70 of electrically conductive material filling the second trench 66 and in contact with the N-type heavily doped GaN layer 48; a first electrically conductive pad 72, for example cylindrical, possibly formed of a stack of several conductive layers, in contact with the conductive layer 56 in an opening 73 passing through the insulating layer 58 at the central portion 61 and intended to be connected at node A; a second electrically conductive pad 74, for example annular, optionally formed of a stack of several conductive layers, in contact with the conductive core 64 and intended to be connected to the node G; and a third electrically conductive pad 76, for example annular, optionally formed of a stack of several conductive layers, in contact with the conductive core 70 and intended to be connected to the node C. The stack of the layers 48, 50, 52 and 54 of the central portion 61 forms the LED light emitting diode. The channel 77 of the TMOS transistor is formed in the portion of the semiconductor layer 46 which extends between the bottom of the trench 60 and the layer 44. The conductive core 70 acts as the source contact of the TMOS transistor. The polarization of the light emitting diode LED is carried out by the conductive pads 72 and 76.
The substrate 42 may correspond to a one-piece structure or correspond to a layer covering a support made of another material. The substrate 42 is preferably a semiconductor substrate, for example a substrate made of silicon, germanium, silicon carbide, silicon nitride, a compound III-V, such as GaN or GaAs, or a ZnO substrate. or in sapphire. Preferably, the substrate 42 is a monocrystalline silicon substrate. Preferably, it is a semiconductor substrate compatible with the manufacturing processes implemented in microelectronics. The substrate 42 may correspond to a multilayer structure of silicon on insulator type, also called SOI (acronym for Silicon On Insulator). Alternatively, the substrate 42 is an insulating substrate, for example a sapphire substrate (Al2O3). The substrate 42 may have a thickness of between 300 μm and 2000 μm. The stack 44 of layers makes it possible to promote the epitaxial growth of the subsequent layers on the substrate 42. The thickness of the stack 44 is between 500 nm and 15 μm, for example about 1 μm. In the case where the substrate 42 is silicon and the layers 46, 48 and 54 are GaN, the stack 44 may comprise a barrier layer gallium blocking, for example an aluminum nitride (AlN) layer. In fact, gallium can react strongly with silicon at the temperatures at which the semiconductor layers are fed during the manufacturing process of the optoelectronic device. The stack 44 may furthermore comprise semiconductor layers which allow mesh matching between the semiconductor layers 46, 48 and the substrate 42. By way of example, in the case where the substrate 42 is made of silicon and the layers 46, 48, and 54 are in GaN, the stack 44 may comprise AlxGa] x xN layers where x may vary from 0 to 1 inclusive. The thickness of the N-type weakly doped GaN layer 46 is between 50 nm and 3 μm. The concentration of N-type dopants of layer 46 is between 10 4 atoms / cm 2 and 10 5 atoms / cm 2, preferably between 5 × 10 7 atoms / cm 2 and 5 × 10 7 atoms / cm 2. .
The minimum distance T between the stack 44 and the bottom of the first trench 60 is between 50 nm and 150 nm and is preferably between 50 nm and 100 nm when the concentration of N-type dopants of the layer 46 is greater than 10-L7 atoms / cm 2.
The length L of the channel 77 of the TMOS transistor, which corresponds substantially to the thickness of the conducting core 64 measured in a direction perpendicular to the stacking direction of the layers 46, 48, 50, 52 and 54, that is to say to say the difference between the outer diameter and the inner diameter of the conductive core 64 in the case of an annular conductive core 54 is between 10 times and 50 times, preferably between 10 times and 20 times, the thickness of the channel for example between 1 pm and 5 pm. The thickness of the N-type heavily doped GaN layer 48 is between 100 nm and 5 μm. The concentration of N-type dopants in the layer 48 is in the range of 10 -4 atoms / cm 2 to 10 0 atoms / cm 3, for example about 10 5 atoms / cm 3.
The conductive layer 56 makes it possible to reflect the photons emitted by the light-emitting diode.
The insulating layer 58 may be silicon oxide (SiC> 2). The insulating layer 62 may be hafnium oxide (HfC> 2), aluminum oxide (Al2O3) or silicon nitride (SiNx). The thickness of the insulating layer 62 at the channel of the TMOS transistor may be between 1 nm and 40 nm.
According to another embodiment, the gate of the MOS transistor can be replaced by a Schottky gate. A transistor of the MESEET type (acronym for Metal Semiconductor Field Effect Transistor) is then obtained. In this case, the insulating layer 62 is not present at the bottom of the trench 60 and the conductive core 64 is in contact with the semiconductor layer 46 and forms a Schottky diode at this interface. The conducting core 64 is then preferably a metal having an output work of greater than 4 eV, for example nickel.
The operation of the MOS transistor or the MESFET transistor is as follows. Depending on the voltage between the gate and the transistor source, the channel will be on or off. When the channel is conducting, electrons can flow from node C via the channel to the active area of the light emitting diode to recombine with holes. When the channel is not conducting, electrons do not flow from node C to the active area of the light emitting diode.
The fact that the light-emitting diode LED is directly adjacent to the TMOS transistor advantageously makes it possible to reduce the lateral size of the optoelectronic device 40 relative to the optoelectronic device 10.
FIG. 5 represents an embodiment of an optoelectronic system 78 in which the optoelectronic device 40, as represented in FIG. 3, is fixed to a support 80, for example another electronic circuit on the side of the conductive pads 72, 74 and 76. The surface of the optoelectronic device 40 on which the conductive pads 72, 74 and 76 are substantially flat, the attachment of the optoelectronic device 40 to the support 80 on the side of the conductive pads 72, 74 and 76 is facilitated. According to one embodiment, as shown in FIG. 5, the substrate 42 can be removed to facilitate the emission of the light emitted into the active zone of the LED light emitting diode.
FIGS. 6 to 9 show curves, respectively C1, C2, C3 and C4, of evolution of the current density crossing the LED of the optoelectronic device 40 shown in FIG. 3 as a function of the voltage V ^ c between the nodes A and C for different voltages applied to the gate of the TMOS transistor. The voltage at the gate is referenced with respect to the node C. The curves C1, C2, C3 and C4 were obtained by simulation with the following parameters: substrate 42 made of silicon with a thickness of 1 p / layer 44 of AIN with a thickness 1 p / layer 46 of N-type doped GaN with a thickness of 200 nm and a dopant concentration of 10 atoms / cnP; layer 48 of N-type doped GaN with a thickness of 2 μ and a dopant concentration of 10 atoms / cnP; active layer 50 comprising multiple quantum wells with a total thickness of 100 nm; layer 52 of P type doped AlGaN with a thickness of 100 nm and a dopant concentration of 10 ^ atoms / cm 2; layer 54 of P type doped GaN with a dopant concentration of 10 atoms / cm 2; length L of channel 77 of the 5 μ TMOS transistor; distance T of 100 nm; and thickness of the insulating layer 62 at the channel 77 of the 10 nm TMOS transistor.
Curve C1, shown in FIG. 6, was obtained with a gate voltage of -2 V. Virtually no current flows through the LED. The TMOS transistor then plays the role of an open switch.
Curve C2, shown in FIG. 7, was obtained with a gate voltage of 0 V. The current density passing through the LED was 1.8 A / cm 2 for a voltage V g equal to 3 V.
The curve C3 shown in FIG. 8 was obtained with a gate voltage of 2 V. The current density passing through the LED was 100 A / cm 2 for a voltage VAC equal to 6 V.
The curve C4 shown in FIG. 9 was obtained with a gate voltage of 8 V. The current density passing through the LED was 200 A / cm 2 for a YAC voltage equal to 6 V. The conductivity of the TMOS transistor increases. when the gate voltage increases.
FIGS. 10A to 10F are sectional, partial and schematic views of the structures obtained at successive stages of an embodiment of a method of manufacturing the optoelectronic device 40 shown in FIG.
FIG. 10A represents the structure obtained after having grown the semiconductor layers 44, 46, 48, 50, 52 and 54 on the substrate 42. The growth process of these layers can be a chemical vapor deposition process (CVD) Chemical Vapor Deposition) or organometallic chemical vapor deposition (MOCVD), also known as metal vapor organic phase epitaxy (MOVPE). -Organic Vapor Phase Epitaxy). However, processes such as Molecular-Beam Epitaxy (MBE), gas-source MBE (MBBE), organometallic MBE (MOMBE), plasma-assisted MBE (PAMBE), Atomic Layer Epitaxy (ALE) or hydride vapor phase epitaxy (HVPE) can be used.
FIG. 10B represents the structure obtained after having deposited the conductive layer 56 on the layer 54 and after having formed the insulating layer 58 on the conductive layer 56. The conductive layer 56 can be deposited by physical vapor deposition (PVD, English signal for Physical Vapor Deposition). The insulating layer 58 may be deposited by CVD or PVD.
FIG. 10C shows the structure obtained after having formed the first and second trenches 60, 66 and after having deposited the insulating layer 62 on all the walls of the first trench 60 and the insulating layer 68 on all the walls of the second trench 66. The first and second trenches 60, 66 may be produced by anisotropic etching, for example deep ionic reactive etching. Insulating layers 62, 68 may be deposited by Atomic Layer Deposition (ALD).
The dopant concentration of the layer 46 which is reduced relative to the layer 48 makes it possible to obtain a channel thickness T of the TMOS transistor which is greater than that which would be expected if the dopant concentration of the layer 46 were greater. This makes it possible to implement an etching process for the formation of the first trench 60 in which the etching stop can be obtained with an accuracy of +/- 10 nm.
FIG. 10D shows the structure obtained after having etched the insulating layer 68 at the bottom of the trench 66. The etching of the insulating layer 68 can be carried out by an ion beam etching in the trench 66. In the present embodiment the second trench 66 extends over the entire thickness of the N-type heavily doped GaN layer 48 and the insulating layer 68 is removed for that portion of the trench 66 extending into the layer 48.
FIG. 10E shows the structure obtained after forming the opening 73 in the insulating layer 58, for example by anisotropic etching.
FIG. 10F represents the structure obtained after having deposited a metal layer on the whole of the structure represented in FIG. 10E, and in particular in the opening 73, in the first trench 60 and in the second trench 66, and after removing the portions of the metal layer outside the opening 73, the first trench 60 and the second trench 66, for example by a chemical etching step with etching stop on the insulating layer 58. In the present embodiment, the The same metal is used to form the conductive cores 64, 70 and the conductive pad 74. Alternatively, different materials may be used to make the conductive cores 64, 70 and the conductive pad 74.
Particular embodiments have been described. Various variations and modifications will be apparent to those skilled in the art. In particular, although embodiments of optoelectronic devices have been described in which the optoelectronic device comprises at least one light emitting diode, it is clear that the electroluminescent component may be a different component of a light emitting diode. By way of example, the electroluminescent component may comprise a laser diode, for example a surface-emitting and vertical-cavity laser, also called vertical-external-cavity-surface-emitting-laser (VCSEL) laser. In addition, although in the previously described embodiments the MOS transistor is N-channel, it is clear that the optoelectronic device may comprise a P-channel MOS transistor obtained by inverting the conductivity types of the semiconductor layers. In addition, although in the previously described embodiments the conductive cores 64 and 70 have a ring-shaped annular fome, the conductive cores 64, 70 may have a different shape, for example a planar fome or a square-based annular shape. .

权利要求:
Claims (17)
[1" id="c-fr-0001]
An optoelectronic device (40) comprising an electroluminescent component (LED) and a field effect transistor (TMOS), the optoelectronic device comprising: a first semiconductor layer (46) of a III-V compound or II-VI doped with a first type of conductivity; an active layer (50) of the electroluminescent component; a second semiconductor layer (54) of the III-V or II-VI compound doped with a second conductivity type opposite to the first type, the active layer being sandwiched between the first and second semiconductor layers, wherein the channel (77) ) of the field effect transistor is located in the first semiconductor layer, the first semiconductor layer being uninterrupted between the field effect transistor and the electroluminescent component.
[2" id="c-fr-0002]
Optoelectronic device according to claim 1, comprising a first trench (60) successively traversing at least the second semiconductor layer (54), the active layer (50) and only a part of the first semiconductor layer (46), and containing a first electrically conductive core (64) and a first electrically insulating first layer (62) covering the walls of the first trench at least between the first electrically conductive core (64) and the second semiconductor layer (54) and between the first electrically conductive core ( 64) and the active layer (50).
[3" id="c-fr-0003]
An optoelectronic device according to claim 2, wherein the first electrically insulating layer (62) overlies the walls of the first trench (60) between the first electrically conductive core (64) and the first semiconductor layer (46).
[4" id="c-fr-0004]
An optoelectronic device according to claim 2, wherein the first electrically conductive core (64) is in contact with the first semiconductor layer (46).
[5" id="c-fr-0005]
Optoelectronic device according to claim 4, wherein the output work of the material constituting the first electrically conductive core (64) is greater than 4 eV.
[6" id="c-fr-0006]
An optoelectronic device according to any one of claims 2 to 5, further comprising a third semiconductor layer (48) of the first conductivity type doped compound III-V or II-VI having a dopant concentration greater than dopant concentration of the first semiconductor layer (46) in contact with the first semiconductor layer (46) and interposed between the first semiconductor layer (46) and the active layer (50).
[7" id="c-fr-0007]
Optoelectronic device according to claim 6, comprising a second trench (66) successively traversing at least the second semiconductor layer (54), the active layer (50) and all or part of the third semiconductor layer (48), and containing a second electrically conductive core (70) in contact with the third semiconductor layer and containing a second electrically insulating second layer (68) covering the walls of the second trench at least between the second electrically conductive core (70) and the second semiconductor layer ( 54) and between the second electrically conductive core and the active layer (50).
[8" id="c-fr-0008]
Optoelectronic device according to claim 7, comprising a first electrically conductive pad (74) in contact with the first electrically conductive core (64) and a second electrically conductive pad (76) in contact with the second electrically conductive core (70), the first and second studs resting on a flat surface;
[9" id="c-fr-0009]
Optoelectronic device according to any one of claims 1 to 8, wherein the active layer (50) - is the layer from which is emitted the majority of the electromagnetic radiation provided by the optoelectronic device.
[10" id="c-fr-0010]
The optoelectronic device of claim 9, wherein the active layer (50) comprises a single quantum well or multiple quantum wells.
[11" id="c-fr-0011]
An optoelectronic device according to any one of claims 1 to 10, wherein the dopant concentration of the first semiconductor layer (46) is between 10-L5 atoms / cm 2 and 10 8 atoms / cm 2, preferably between 5 × 10 -6 atoms / cm 2 and 5 × 10 -3 atoms / cm 2.
[12" id="c-fr-0012]
An optoelectronic device according to any one of claims 1 to 11, wherein the thickness of the second semiconductor layer (54) vis-à-vis the first trench (60) is between 50 nm and 150 nm when the dopant concentration of the second semiconductor layer (54) is greater than 10 ^ atoms / cm 2.
[13" id="c-fr-0013]
An optoelectronic device according to any one of claims 2 to 8, wherein the thickness of the first electrically conductive core (64) is between 10 times and 50 times the thickness of the first semiconductor layer (46) facing with respect to the first trench (60).
[14" id="c-fr-0014]
A method of manufacturing an optoelectronic device (40) comprising an electroluminescent component (LED) and a field effect transistor (TMOS), the method comprising the following successive steps: forming a first semiconductor layer (46) of a III-V or II-VI compound doped with a first type of conductivity; forming an active layer (50) of the electroluminescent component; forming a second semiconductor layer (54) of the doped III-V or II-VI compound of a second conductivity type opposite to the first type, the active layer being sandwiched between the first and second semiconductor layers; and forming the field effect transistor channel (77) in the first semiconductor layer, the first semiconductor layer being uninterrupted between the field effect transistor and the electroluminescent component.
[15" id="c-fr-0015]
The method of claim 14, further comprising the steps of: forming a first trench (66) successively traversing at least the second semiconductor layer (54), the active layer (50) and only a portion of the first layer semiconductor (46); and forming, in the first trench, a first electrically conductive core (64) and a first electrically insulating layer (62) covering the walls of the first trench at least between the first electrically conductive core and the second semiconductor layer (54) and between the first electrically conductive core and the active layer (50).
[16" id="c-fr-0016]
The method of claim 15, further comprising the step of forming a third semiconductor layer (48) of the first conductivity type doped III-V or II-VI compound having a dopant concentration greater than dopant concentration of the first semiconductor layer (46) in contact with the first semiconductor layer and interposed between the first semiconductor layer and the active layer (50).
[17" id="c-fr-0017]
The method of claim 16, further comprising the steps of: forming a second trench (66) successively traversing at least the second semiconductor layer (54), the active layer (50) and only a portion of the third layer semiconductor (48); and forming, in the second trench, a second electrically conductive core (70) in contact with the third semiconductor layer and a second electrically insulating second layer (68) covering the walls of the second trench at least between the second electrically conductive core and the second semiconductor layer (54) and between the second electrically conductive core and the active layer (50).

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同族专利:

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公开号 | 公开日

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WO2017093678A1|2017-06-08|

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FR3044822B1|2018-01-05|

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US10497743B2|2019-12-03|

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KR20180089436A|2018-08-08|

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JP2018536293A|2018-12-06|

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EP3384531B1|2020-03-25|

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US20180350870A1|2018-12-06|

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JP6968796B2|2021-11-17|

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EP3384531A1|2018-10-10|

引用文献:

---

公开号 | 申请日 | 公开日 | 申请人 | 专利标题

---

---

DE3751243T2|1986-02-18|1995-08-31|Toshiba Kawasaki Kk|Optoelectronic component and method for its production.|US10890712B2|2018-05-11|2021-01-12|Raytheon Bbn Technologies Corp.|Photonic and electric devices on a common layer|

---

US20210305449A1|2020-03-27|2021-09-30|Harvatek Corporation|Light source assembly, optical sensor assembly, and method of manufacturing a cell of the same|

---

CN111682043A|2020-06-24|2020-09-18|京东方科技集团股份有限公司|Chip structure, manufacturing method thereof and display device|

法律状态:
2016-12-29| PLFP| Fee payment|Year of fee payment: 2 |

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2017-06-09| PLSC| Publication of the preliminary search report|Effective date: 20170609 |

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2018-01-02| PLFP| Fee payment|Year of fee payment: 3 |

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2019-12-31| PLFP| Fee payment|Year of fee payment: 5 |

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2020-12-28| PLFP| Fee payment|Year of fee payment: 6 |

优先权:

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申请号 | 申请日 | 专利标题

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FR1561797A|FR3044822B1|2015-12-03|2015-12-03|OPTOELECTRONIC DEVICE COMPRISING AN ELECTROLUMINESCENT COMPONENT AND A TRANSISTOR|

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FR1561797|2015-12-03|FR1561797A| FR3044822B1|2015-12-03|2015-12-03|OPTOELECTRONIC DEVICE COMPRISING AN ELECTROLUMINESCENT COMPONENT AND A TRANSISTOR|

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PCT/FR2016/053173| WO2017093678A1|2015-12-03|2016-12-01|Optoelectronic device comprising a light-emitting component and a transistor|

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US15/781,085| US10497743B2|2015-12-03|2016-12-01|Optoelectronic device comprising a light-emitting component and a transistor|

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KR1020187017420A| KR20180089436A|2015-12-03|2016-12-01|An optoelectronic device having a light emitting component and a transistor|

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EP16819145.0A| EP3384531B1|2015-12-03|2016-12-01|Optoelectronic device comprising a light-emitting component and a transistor|

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JP2018528561A| JP6968796B2|2015-12-03|2016-12-01|Optoelectronic device with light emitting element and transistor|